Resin epoxy CAS#24969-06-0

  • High epoxy functionality, forms high cross-link density after curing, outstanding heat resistance and high thermal deformation temperature

  • Excellent electrical insulation, low dielectric loss, reliable for electronic encapsulation and PCB laminates

  • Superior chemical resistance against acids, alkalis and solvents, good anti-corrosion performance

  • Great mechanical strength, high bonding strength with metals, glass, fiber and fillers

  • Compatible with common epoxy curing agents, can be blended with bisphenol A epoxy resin to upgrade heat resistance

  • Widely used for high-temperature coatings, electronic potting, composite laminates, FRP and adhesive systems

  • Stable batch quality, low impurity content, available in drum packaging for bulk export, COA & SDS supplied

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Products Description

Epoxy resin is a high-performance thermosetting polymer widely used in coatings, adhesives, and composite materials due to its excellent adhesion, outstanding chemical resistance, and superior electrical insulation properties. It has been extensively applied in various industrial sectors, including automotive manufacturing, aerospace engineering, and construction, where it helps improve the strength, durability, and overall performance of finished products.

In scientific research and material development, epoxy resin plays an important role in advancing polymer technology and the development of innovative composite materials. Its versatile chemical structure and excellent mechanical properties make it suitable for a broad range of engineering and industrial applications.

Epoxy resin is available in various grades, viscosities, and formulations to accommodate different processing requirements and application needs. Key characteristics include its typical amber appearance in solid form, ability to form a rigid thermosetting structure upon curing, and customizable physical and chemical properties. These features make epoxy resin a valuable material for specialized coatings, structural adhesives, electrical components, and high-performance composite applications.

Resin epoxy CAS#24969-06-0

Chemical Properties

Melting point 

115-120 °C

density 

1.36 g/mL at 25 °C(lit.)

Tg

-22

Fp 

252 °C

form 

slab/chunk

Dielectric constant

2.5(Ambient)

EPA Substance Registry System

Oxirane, (chloromethyl)-, homopolymer (24969-06-0)

Safety Information

Hazard Codes 

Xi,N

Risk Statements 

36/38-43-51/53

Safety Statements 

24/25-61-37/39-28

RIDADR 

UN 3082 9/PG 3

WGK Germany 

3

RTECS 

KC2100000

TSCA 

TSCA listed

HS Code 

39072090

Toxicity

LD50 oral in rat: 1200mg/kg

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