POLYIMIDE RESIN CAS#62929-02-6

  • Outstanding thermal stability, continuous service temperature up to 260°C, withstand intermittent high temperature, excellent thermal oxidative resistance, low thermal expansion rate

  • Superior electrical performance: low dielectric constant, high insulation resistance, stable dielectric property under high frequency and wide temperature range, ideal for 5G and high-speed electronic devices

  • Balanced mechanical performance: high tensile strength, good toughness, wear resistance and dimensional stability

  • Excellent chemical resistance, resistant to most organic solvents, oils and weak acids; good radiation resistance

  • Available in thermoplastic and thermoset grades, good compatibility with fillers, carbon fiber, glass fiber for composite manufacturing

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Products Description

Polyimide Resin (PI, CAS 62929-02-6, Matrimid 5218) is a high-performance aromatic polyimide polymer. It is yellow fine powder with outstanding thermal stability, excellent mechanical strength, low dielectric property and superior chemical resistance. Widely used in aerospace, electronics, high-temperature composites, adhesives, separation membranes and advanced coating systems.

Product Name:

POLYIMIDE RESIN

Synonyms:

-2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1h-inden-5-amine;3-isobenzofurandione,5,5’-carbonylbis-polymerwith1(or3)-(4-aminophenyl);POLYIMIDE RESIN;Polyimideresins;Polyimides;1,3-Isobenzofurandione, 5,5-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine;5(6)-Amino-1-(4-anilino)-1,3,3-tetramethylindan-benzophenonetetracarboxylic;PolyiMide filM, 0.025MM thick x 20MM width

CAS:

62929-02-6

MF:

C35H28N2O7

MW:

588.60602

EINECS:

214-686-6

Product Categories:

 

Mol File:

62929-02-6.mol

POLYIMIDE RESIN

Chemical Properties

Melting point 

>300°C

density 

1.2

Fp 

>93°(199°F)

form 

Powder

Specific Gravity

1.2

color 

Yellow

Water Solubility 

Insoluble in water.

InChIKey

CDTDIQLZIBORMV-UHFFFAOYSA-N

EPA Substance Registry System

1,3-Isobenzofurandione, 5,5'-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or 1,1,3)-trimethyl-1H-inden-5-amine (62929-02-6)

Product Applications

Soluble thermoplastic polyimides are widely used in high-temperature adhesives and composite materials. Polyimide sealing is employed to establish permanent, leak-proof connections between two sections of silica tubing, stainless steel, or glass, with press-fit joints being the most commonly used configuration. In the electronics industry, these materials are utilized in flexible cables, as insulating films for magnet wires, and in medical tubing. They also serve as mechanical stress-relief buffers. Furthermore, polyimides are used in reverse osmosis membranes for water purification and for concentrating dilute substances in aqueous solutions, such as in maple syrup production.

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